Subject: Re: Re: Re: Orcad layout settings

: : : I am using the minimum track widths for routing --that being 0.15mm.
: : : Are you capable of manufacture my board reliably?
: : :
: : : Is the probability of having broken tracks due to etching or some other process high?
: : :
: : : Please note, that I still can't find answers for:
: : : 1) min track-to-track spacing.
: : : 2) min track-to-via spacing.
: : : 3) min track-to-pad spacing.
: : : 4) min via-to-via spacing.
: : : 5) min via-to-pad spacing.
: : : 6) min pad-to-pad spacing.
: : :
: : : It would be extremely helpful for me if you could state these parameters for me. Also, I believe this would be beneficial to anyone else following your FAQs.
: : :
: : : Many thanks,
: : : Paul.
: :
: :
: : Hi Paul,
: : The answer to you first question is yes.
: : We can reliably produce track widths of 0.15mm.
: : Our minimum gap requirments are also 0.15mm.
: : Please take a look at the following link from our website for more information.
: : http://www.pcb-pool.com/download/spezifikation/eng_e_technik.pdf
: :
: : Thank you for you interest in Pcb-Pool
: : Best Regards
: : Your Pcb-Pool Team
: :
: :
:
: Thank you for your reply.
:
: From: http://www.pcb-pool.com/download/spezifikation/eng_e_technik.pdf
:
: I get that: Multilayer clearance recess on inner layers(M) = 0.5mm.
:
: Does this imply that on the inner layers, the minimum separation between the vias (from their drill edges NOT their centers)is equal to "minimum annular ring around via (C-D = 0.3mm)" plus two times "Multilayer clearance recess on inner layers(M = 0.5mm)"? That is:
: minimum separation between vias on inner layers= 0.3mm + 1mm = 1.3mm?
:
: I cannot find the minimum separation between vias (from their drill edges NOT their centers) on the outer layers though. could you please instruct me on how to get this information?
:
: The minimum non-copper region between the pads has to be equal to the minimum air gap (ie: 0.15mm)?
:
: Regards,
: Paul.
:
:
:
:


Hi Paul,
The distance M is the minimum clearance required between the edge of any unused drill and copper on an innerlayer. This distance must be 0.5mm On your data you may have pads on all drills in the inner layers but for our manufacturing process we will remove these if the pad is unused(not connected to any track).
All other parameters for inner layers are the same as those fro outer layers.
Therefore the minimum distance between via centers is equal to the drill size + 0.3mm(C-D) + 0.15mm(A)
The minimum distance between via drill edges is 0.3mm(C-D) + 0.15mm(A)
And the answer to your last question is yes. Airgap is the term we use for Non Copper.

Hope this explanation is clear. If not feel free to give me a call. It may be easier to explain over the phone.

Best Regards
Seamus Noonan