Subject: Pads available on copper pour area through solder mask

Hello,

I intend using your services very soon, but before I do, could you answer a few simple questions.

I am using Easy PC s/w to develop a double sided board that contains a mixture of SMT and conventional (through hole) components. Firstly there are different layouts of SMT parts on the two sides of the board, so does this mean I need two different solder masks?

Also there are SMT and conventional components that are connected to GND which I intend to link to a copper pour area (ground plane) on both sides. I want to pour the copper without selecting ‘thermal pads’ ie no spokes. This then pours copper over any pad (smt & conventional) that is connected to GND and removes the pad from view.

My question is: when you use the solder mask, will the original pads still be available to solder to? i.e not green

Thanks for the help.

Adrian